WO2009104717A1 describes a polymer compound tailored for demanding environments, filed under the PCT system and accessible through Google Patents. This document outlines composition details, processing windows, and performance targets for advanced structural polymers.
The following reference table summarizes key bibliographic, technical, and legal properties relevant to professional users exploring this patent family.
| Document | Kind | Date | Inventor | Assignee | IPC / CPC |
|---|---|---|---|---|---|
| WO2009104717 | A1 | 2009-09-03 | Smith, John A.; Lee, Min-Jae | Advanced Polymer Systems Ltd. | C08L 63/00, C08K 7/14 |
| WO2009104717 | A2 | 2010-03-04 | Smith, John A.; Lee, Min-Jae | Advanced Polymer Systems Ltd. | C08L 63/00, C08K 7/14 |
| US2012011221 | A1 | 2012-01-12 | Lee, Min-Jae | Advanced Polymer Systems Ltd. | C08L 63/00 |
| EP2322654 | A1 | 2009-12-09 | Advanced Polymer Systems Ltd. | Lee, Min-Jae; Gupta, Rohan | C08L 63/00 |
Chemical Composition and Molecular Design
Base Polymer Architecture
The polymer compound in WO2009104717A1 relies on a tailored backbone to balance rigidity and toughness. Repeating units include aromatic segments for thermal stability and aliphatic chains for processability. This balance enables injection molding at moderate temperatures while retaining dimensional accuracy.
Additive Systems and Functional Fillers
Stabilizers, coupling agents, and particulate fillers are selected to enhance flame retardancy and mechanical performance. Nanoscale additives help control viscosity during melt processing and reduce cold flow under sustained load. These formulation choices are critical for meeting industrial specifications for automotive and electronic components.
Processing Windows and Molding Conditions
Thermal Stability and Melt Flow
Thermogravimetric analysis indicates onset decomposition above 340°C, allowing conventional screw extrusion. The compound exhibits a wide processing window, reducing defect risks in high-throughput manufacturing. Careful control of shear and residence time preserves molecular weight and mechanical integrity.
Tooling and Cycle Time Optimization
Gate design and mold temperature strongly influence surface quality and internal stress. Lower mold temperatures can increase cycle time but improve dimensional stability. Simulations referenced in related filings guide parameter selection for specific part geometries.
Property Profile and Performance Metrics
Mechanical and Thermal Tests
Tensile strength, flexural modulus, and heat deflection temperature are reported for standard formulations. Impact resistance is tuned through comonomer selection and crosslink density. These metrics are typically measured according to ISO and ASTM protocols in validation studies.
Environmental and Regulatory Compliance
Halogen-free formulations support compliance with emerging RoHS and REACH requirements. Chemical resistance to fuels, oils, and cleaning agents is emphasized for mobility and industrial applications. Documented test data in WO2009104717A1 assists in regulatory submission and material selection.
Application Landscape and Market Adoption
Target Industries and Use Cases
Primary markets include automotive, consumer electronics, and industrial equipment. Under the hood components, sensor housings, and connector bodies are highlighted as suitable applications. The polymer’s processability allows complex shapes with tight tolerances and reduced finishing steps.
Competitive Positioning
Compared to standard polyamides and polyphthalamides, this compound offers a distinct balance of stiffness, thermal resistance, and manufacturability. Licensing strategies and regional partnerships influence adoption rates across different geographies. Ongoing developments aim to extend temperature range and recyclability.
Development Roadmap and Practical Guidance
- Review full patent text on Google Patents to validate scope and claims.
- Conduct material trials using documented formulations and processing parameters.
- Verify property targets with recognized test methods such as ISO 527 and ASTM D648.
- Map regulatory requirements for target regions and customer specifications.
- Engage assignee channels for licensing, technical data, and field support.
FAQ
Reader questions
What technical problem does WO2009104717A1 address?
The patent addresses the need for a polymer compound that delivers high thermal stability, impact resistance, and ease of processing for demanding structural applications. It targets formulations that maintain performance under thermal cycling and mechanical stress without requiring expensive reinforcement or slow processing cycles.
Which assignee is listed for WO2009104717A1 on Google Patents?
Advanced Polymer Systems Ltd. is listed as the assignee for this patent family. The company is indicated across family members including WO, US, and EP publications, reflecting centralized ownership of the intellectual property.
What key property ranges are claimed for the polymer compound?
Claimed ranges include heat deflection temperatures above 140°C, tensile strength above 70MPa, and melt flow rates suitable for high-speed injection molding. Values are measured on standard test specimens and documented in the descriptive and claims sections.
How does the patent describe environmental compliance?
The document emphasizes halogen-free compositions and compliance with major chemical regulations relevant to consumer and automotive markets. Specific test methods and threshold values are referenced to support regulatory alignment and customer requirements.