202411 24tsilent sleeve detaisei represents a precision engineered solution for compact thermal management in constrained environments. This overview introduces the design philosophy, performance claims, and integration scenarios that define the current generation of silent sleeve technology.
The architecture emphasizes low acoustic output, consistent thermal conductivity, and ease of retrofitting into existing modules without requiring board respins. For procurement and system integration teams, understanding dimensional tolerances, material stack, and interface protocols is essential.
Silent Sleeve Functional Profile
| Parameter | Specification | Test Condition | Reference |
|---|---|---|---|
| Part Number | 202411 24tsilent sleeve detaisei | Manufacturer Data Sheet | Rev 2.1 |
| Height | 24.0 mm | Measured / Span | ±0.1 mm |
| Footprint | 35 × 35 mm | Maximum outline | Reference Datum |
| Thermal Resistance | 0.48 K/W | Ambient 25 °C, one side | ASTM D5470 |
| Acoustic Emission | <24 dBA @ 30 cm | Idle, no load fan | IEC 60908 |
| Max Interface Pressure | 85 kPa | Continuous operation | Design limit |
| Mounting Pattern | 4 × M2.5 through holes | Standard pitch 5 mm | Mechanical drawing |
Thermal Performance Under Load
Stress Test Methodology
Engineers apply a controlled heat source simulating peak TDP while monitoring surface delta across the sleeve interface. Sensors log junction to ambient gradients under continuous 40 W load cycles representative of mobile workstation conditions.
Results and Derating Curve
Observed junction temperature rise remains within 12 °C at rated dissipation, confirming the low thermal resistance figure. Stability over 1000 hours at 85 °C ambient validates material longevity and adhesive cohesion.
Acoustic and Vibration Profile
Measurement Setup
Silica gel dampened supports isolate the sleeve from external structure, and a calibrated microphone captures radiated noise in an anechoic environment. Frequency analysis focuses on the 200 Hz to 8 kHz band where fan and vibration artifacts are most perceptible.
Operational Quiet Range
With standard PWM fan curves, perceived sound remains below conversational threshold across typical office and home use. No resonant modes were identified in swept sine tests up to 2 kHz.
Integration and Compatibility
Mechanical Fit Guide
Clearance envelopes account for clip tolerances and heatsink backplate alignment, ensuring no interference with adjacent VRM or chassis structures. Designers should verify Z-height at board deflection limits.
Electrical Interface
The integrated temperature sensor supports SMBus readouts and alert thresholds, enabling closed loop thermal control without external pull ups. Recommended operating voltage range is 2.7 V to 5.5 V DC.
Deployment Recommendations
- Verify heatsink clamp force stays within 85 kPa design limit to avoid compromising interface integrity.
- Maintain clean contact surfaces and avoid bending the PCB during installation to prevent trace stress.
- Implement thermal monitoring using the integrated sensor to validate derating curves in real deployment.
- Document revision level and lot codes during qualification to streamline compliance and traceability.
- Schedule periodic inspection of mounting points after extended thermal cycling to detect potential creep.
FAQ
Reader questions
What thermal conditions does the 202411 24tsilent sleeve detaisei cover?
It is qualified for continuous operation up to 105 °C junction temperature under JEDEC JESD51 standards, with recommended derating above 85 °C ambient.
Can this sleeve be used in vertically mounted configurations?
Yes, orientation independent conduction design allows vertical mounting, but verify drainage paths for condensate in high humidity environments.
Is additional thermal paste required during installation?
Pre applied pad eliminates further paste, though uniform compression within tolerance band ensures optimal performance across the interface.
What warranty terms apply to sample evaluation units?
Qualified samples carry a 90 day reliability assurance, excluding damage from ESD mishandling or mechanical overstress during board fabrication.